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• Thermally Conductive Sheet
• EMI/RFI Shielding
• Sponges - Silicone
• Foams - Silicone
• Small Moulded Parts
• Extrusions
• Chromerics Thermal Products
• Bumpers, Masking Rubber
• Grommets, SPringfast®
• 3M™ and CHR® Electrical
• Tape and Film
• Matting
• O-Ring
• Gloves
• UL Rated Materials
• Moulded to Metal
• Conductive Adhesive
• Soft Shield®
• Poron® Cellular Urethane
• Mil and ASTM Specification Materials
• Parafluor & Parafluor Ultra™
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CASE STUDY
Environmental Instrumentation Company
Compliant gap pad is used in between a microprocessor and a heat sink to dissipate thermal conductivity.
To see more Case Studies or to discuss your bespoke products please contact us
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